2009 - 2010 Intel PhD Fellowship

$23,000 Stipend

Who should apply

• ·       Outstanding students in Engineering
• ·       Outstanding students in Computer Science
• ·       Students in other technical majors focusing on semiconductor technologies, micro-architecture, and communications.
• ·       Students who have past Intel experience and willing to do an Internship
• ·       Students who are within 2 years of graduation
• ·       Cannot be a current Intel Employee

Benefits of an Intel PhD Fellowship

• ·       Tuition
• ·       $23,000 Stipend
• ·       $1,500 Travel Grant
• ·       Internship opportunities
• ·       Invited to a Intel Forum

How to apply

• ·       Submit your application to the Graduate School Fellowship office by email.

fellowships@purdue.edu

• ·       Applications should include student’s CV and 3 letters of recommendation
• ·       Submit all documents as PDF files

Deadline

• ·       Friday, March 6, 2009

 

 

Technical Areas

• Hardware Systems Technology and Design

Computer Architecture

Low Power

Input/Output

CAD

Networking

RF Interference Mitigation Circuits

RF Interference Algorithms

Platform Digital Power Control

Acoustic Actuators

Waveguide Characterization

Digital CMOS Circuit Design (both high performance, and low power areas)

Analog CMOS Circuit Design (opamps, baseband filters, analog to digital converters, mixed signal)

RFIC CMOS Circuits (for wireless and broadband high speed links)

Signal Processing

Cluster and datacenter management

Mobile Computing

• Software Technology and Design

Visual Computing

Operating Systems

Compiler Technology

Human Interfaces

Parallel Programming

Machine Learning

Social Research and Design

Robotic sensing and manipulation

Data-intensive computing

Computational perception

Distributed systems

Mobile computing

• Semiconductor Technology and Manufacturing

Device Physics

Materials Science

Semiconductor Process

Lithography

Nanotechnology

Thermal Management (macroscopic and microscopic thermal modeling and heat sinking ideas)

Packaging

Manufacturing Science

Novel materials and concepts for Non-Volatile Memory

 

http://www.intel.com/education/highered/studentprograms/fellowship.htm